Odisha Institutes Shine as ‘Made in India’ Chips Presented to PM Modi
NIT Rourkela and PMEC Berhampur Contribute to Nation’s Semiconductor Journey
Bhubaneswar : Union Electronics and IT Minister Ashwini Vaishnaw presented the first batch of ‘Made in India’ chips to Prime Minister Narendra Modi at the Semicon India 2025 in New Delhi on Tuesday. Notably, three of these chips were designed in Odisha—two by NIT Rourkela and one by Parala Maharaja Engineering College (PMEC), Berhampur.
The VG Amplifier and Sensor Circuit and Present Encryption Core were designed by NIT Rourkela, while the High-Performance Multiplier IC-C2S0061 was developed at PMEC. Hailing the achievement, Odisha Minister Mohan Charan Majhi said these innovations highlight Odisha’s growing role in India’s semiconductor journey and showcase the talent nurtured in the state.
Inaugurating the conference, PM Modi said India is poised to play a crucial role in the trillion-dollar global semiconductor sector, with investments of \$18 billion already approved in 10 projects since 2021. “The last century was shaped by oil, but the future will be shaped by chips,” he stressed.
Officials said the Odisha-based innovations align with the national vision under the ‘Semicon India 2025’ initiative and the Make in India campaign, positioning the state as a rising hub of digital and technological transformation.
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